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| Liteon Semiconductor Corporation is an affiliated enterprise of the Lite-On Technology Group. It has, among others, three big divisions, namely, the Image Division 、Discrete Components Division and the Wafer Foundry Division： |
| Contact image sensor(CIS) is the major and most important product of the Image Division. One of the two types of this product, the monochrome CIS, is mainly used in fax machines. The other type, color CIS, can be used in scanners and multifunctional peripherals. Liteon Semiconductor is presently global number one CIS maker. In 2003, our Image Division introduced its handset camera module. In 2005, world-wide handset camera module market is expected to increase by leaps and bounds. And most of the first tier handset manufacturers are turning to the COB production process on which Liteon Semiconductor has always banked, we predict blossoming business in 2005 and multiple-fold increases in our sales. |
| Major products of the Discrete Division consist of several types of diode rectifiers, including bridge rectifiers, and SMD diodes, which are used in telecomm equipment, monitors, power supply devices and automobile parts. In the past two years, discrete components made by Liteon Semiconductor enjoyed stable growth at rates above industry average. As our technology and product quality win kudos from the users, Liteon semiconductor works even harder to bring out new products to meet their needs. Our major goal in 2005 is to gain a higher global market share for our disctete component products. |
| Liteon currently manufactures semiconductors in a 6" wafer fab located at Science-Based Industrial Park, Hsin-chu, Taiwan. This fab offers a range of qualified and proven technologies on High Voltage CMOS and Bipolar. With class 1&10 quality-controlled environment and 38,000 pcs of production capacity per month, we guarantees high quality wafers output and flexible production for broad spectrum of products. Additionally, combining with customer's technologies installed for volume orders, our strong capabilities mean that any customer's requirement can be met. The short turn-around time in the stage of prototype, to the fast cycle time in mass production, we reduces customer's time to market and maximizes the flow of wafer production. | |
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